魅族:将暂停国内手机新产品自研硬件项目 积极接洽第三方硬件合作伙伴

· · 来源:lite资讯

Now, to be certain, these types of issues are implementation bugs. The connection leak was definitely something that undici needed to fix in its own implementation, but the complexity of the specification does not make dealing with these types of issues easy.

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iFi's new DAC is eight percent smaller than the previous GO Link and 29 percent lighter, approaching the size of Apple's USB-C to 3.5mm Headphone Jack dongle. The GO Link 2's built-in ESS Sabre DAC chipset is supposed to add "6dB of dynamic range between the loudest and quietest moments" and reduce distortion for clearer sound by up to 62 percent when compared to the original GO Link.

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